Product Name: RIM I/O Module
Brand Name: Bently Nevada
Model Number: 135031-01
Place of Origin: USA
Warranty: 12 Months
Whatsapp：+86 18020776782
Email：[email protected]
Commercial Terms
Minimum Order Quantity |
1 Piece |
Price |
Contact for Winnie |
Packaging Details |
Original new Factory Sealed |
Delivery Time |
3–7 Days |
Payment Terms |
T/T |
Shipping Method |
DHL / FedEx / UPS / TNT |
Supply Ability |
In stock |
The Bently Nevada 135031-01 RIM I/O Module with Modem Interface is a Rack Interface Module designed for the Bently Nevada 3500 monitoring system, serving as the primary communication gateway between the 3500 rack and external systems. Installed in Slot 1 of the rack next to the power supplies, it provides centralized configuration access and data retrieval for all rack modules through a proprietary communication protocol distributed via the rack backplane.
The module is not part of the critical machinery protection signal path, but it is essential for system configuration, communication management, and external connectivity. It also supports integration with external communication processors such as TDXnet, TDIX, and DDIX.
The Bently Nevada 135031-01 RIM I/O Module acts as the main interface for rack-level communication, enabling configuration of the 3500 system and retrieval of machinery condition data. It distributes communication signals across the rack backplane, allowing all monitors and modules to be accessed through a unified interface.
In standard configurations, it supports external modem-based communication up to 14.4 kbaud (Hayes AT command compatible). In Triple Modular Redundant (TMR) systems, it additionally performs monitor channel comparison, continuously evaluating signals from three redundant monitoring channels and identifying deviations. If one channel deviates beyond a configured threshold, it is flagged as faulty and recorded in the system event log.
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Jim Pei |
| Product Name | Bently Nevada 135031-01 RIM I/O Module |
| Manufacturer | Bently Nevada |
| Product Type | RIM I/O Module |
| Part Number | 135031-01 |
| Weight | 0.46kg |
| Estimated shipping dimensions | 2.5x11x24cm |
| Place of shipment | Xiamen, China |
| Country of origin | USA |
| Mounting Position | Rear of 3500 Rack, Slot 1 (aligned with RIM) |
| Communication Speed | Up to 14.4 k baud (Hayes AT command set compatible) |
| Power Consumption | 3.5 Watts typical |
| Operating Temperature | -30°C to +65°C (-22°F to +149°F) |
| Storage Temperature | -40°C to +85°C (-40°F to +185°F) |
| Humidity | 95% Non-condensing |
The 135031-01 provides a stable and centralized communication architecture for the entire 3500 rack, simplifying system configuration and data access. Its separation from the critical monitoring path ensures that communication functions do not interfere with machinery protection performance. The module supports seamless integration with external communication processors, enabling scalable remote monitoring capabilities. In TMR applications, its channel comparison function enhances system reliability by automatically detecting inconsistent sensor or monitor outputs, improving diagnostic accuracy and system integrity.
In addition, the module improves overall system maintainability by enabling straightforward rack-level communication management and reducing the need for direct module-level configuration. Its standardized Slot 1 placement ensures predictable installation, faster commissioning, and easier replacement during maintenance, which helps minimize downtime in critical industrial environments.
The Bently Nevada 135031-01 RIM I/O Module operates with low power consumption of approximately 3.5 W, supporting efficient continuous operation within the rack system. It is designed for reliable communication performance with data transmission speeds up to 14.4 kbaud, compatible with standard modem-based Hayes AT command protocols. The device operates in a wide temperature range from -30°C to +65°C and can be stored between -40°C and +85°C, ensuring suitability for harsh industrial environments. With high humidity tolerance up to 95% non-condensing, it maintains stable communication performance under challenging conditions. Its rack-level architecture ensures efficient data distribution across all connected modules while maintaining system stability and communication integrity.
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